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MB6M器件资料
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器件摘要：
MB2M THRU MB6M
MINIATURE GLASS PASSIVATED SINGLE-PHASE BRIDGE RECTIFIER
Reverse Voltage - 200 to 600 Volts Forward Current - 0.5 Ampere
FEATURES
♦ Plastic package has Underwriters Laboratory Flammability
Classification 94V-0
♦ This series is UL recognized under Component Index,
file number E54214
♦ Glass passivated chip junctions
♦ High surge overload rating: 35A peak
♦ Saves space on printed circuit board
♦ High temperature soldering guaranteed:
260°C/10 seconds, at 5 lbs. (2.3kg) tension
MECHANICAL DATA
Case: Molded plastic body over passivated junctions
Terminals: Plated leads solderable per MIL-STD-750,
Method 2026
Polarity: Polarity symbols marked on body
Mounting Position: Any
Weight: 0.078 ounce, 0.22 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
SYMBOLS MB2M MB4M MB6M UNITS
Device marking code 2 4 6
Maximum repetitive peak reverse voltage VRRM00 Volts
Maximum RMS voltage VRMS20 Volts
Maximum DC blocking voltage VDC00 Volts
Maximum average forward output rectified
current at TA=30°C - on glass-epoxy P.C.B. (NOTE 1) I(AV) 0.5 Amp
on aluminum substrate (NOTE 2) 0.8
Peak forward surge current 8.3msec. single half sine-
wave superimposed on rated load (JEDEC Method)
IFSM 35.0 Amps
Rating for fusing (t<8.3ms) I
2
t 5.0 A
2
sec
Maximum instantaneous forward voltage drop
per leg at 0.4A
VF 1.0 Volts
Maximum DC reverse current at TA=25°C 5.0
μA
rated DC blocking voltage per leg TA=125°C
IR
500
Typical junction capacitance per leg (NOTE 3) CJ 13.0 pF
Typical thermal resistance per leg (NOTE 1) RΘJL 20.0
(NOTE 1) RΘJA 85.0 °C/W
(NOTE 2) RΘJA 70.0
Operating junction and storage temperature range TJ, TSTG -55 to +150 °C
NOTES:
(1) On glass epoxy P.C.B. mounted on 0.05 x 0.05” (1.3 x 1.3mm) solder pads
(2) On aluminum substrate P.C.B. with an area of 0.8 x 0.8 x 0.25” (20 x 20 x 6.4mm) mounted
on 0.05 x 0.05” (1.3 x1.3mm) solder pad
(3) Measured at 1.0 MHZ and applied reverse voltage of 4.0 Volts
0.147 (3.73)
0.137 (3.48)
0.144 (3.65)
0.161 (4.10)
0.106 (2.70)
0.090 (2.30)
0.190 (4.83)
0.179 (4.55)
0.029 (0.74)
0.017 (0.43)
0.012 (0.30)
0.008 (0.20)
0.105 (2.67)
0.095 (2.41)
0.047 (1.19)
0.038 (0.96)
0.205 (5.21)
0.195 (4.95)
0-10°
0.117 (2.97)
0.107 (2.72)
0.028 (0.71)
0.020 (0.51)
0.016(0.41)
0.006 (0.15)
0.100 (2.54)
MIN.
0.049 (1.24)
0.039 (0.99)
Case Style MBM
Dimensions in inches and (millimeters)
PATENT PENDING PATENT PENDING PATENT PENDING
更多器件搜索就在Datasheet 厂商器件资料
器件摘要：
MB2M THRU MB6M
MINIATURE GLASS PASSIVATED SINGLE-PHASE BRIDGE RECTIFIER
Reverse Voltage - 200 to 600 Volts Forward Current - 0.5 Ampere
FEATURES
♦ Plastic package has Underwriters Laboratory Flammability
Classification 94V-0
♦ This series is UL recognized under Component Index,
file number E54214
♦ Glass passivated chip junctions
♦ High surge overload rating: 35A peak
♦ Saves space on printed circuit board
♦ High temperature soldering guaranteed:
260°C/10 seconds, at 5 lbs. (2.3kg) tension
MECHANICAL DATA
Case: Molded plastic body over passivated junctions
Terminals: Plated leads solderable per MIL-STD-750,
Method 2026
Polarity: Polarity symbols marked on body
Mounting Position: Any
Weight: 0.078 ounce, 0.22 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
SYMBOLS MB2M MB4M MB6M UNITS
Device marking code 2 4 6
Maximum repetitive peak reverse voltage VRRM00 Volts
Maximum RMS voltage VRMS20 Volts
Maximum DC blocking voltage VDC00 Volts
Maximum average forward output rectified
current at TA=30°C - on glass-epoxy P.C.B. (NOTE 1) I(AV) 0.5 Amp
on aluminum substrate (NOTE 2) 0.8
Peak forward surge current 8.3msec. single half sine-
wave superimposed on rated load (JEDEC Method)
IFSM 35.0 Amps
Rating for fusing (t<8.3ms) I
2
t 5.0 A
2
sec
Maximum instantaneous forward voltage drop
per leg at 0.4A
VF 1.0 Volts
Maximum DC reverse current at TA=25°C 5.0
μA
rated DC blocking voltage per leg TA=125°C
IR
500
Typical junction capacitance per leg (NOTE 3) CJ 13.0 pF
Typical thermal resistance per leg (NOTE 1) RΘJL 20.0
(NOTE 1) RΘJA 85.0 °C/W
(NOTE 2) RΘJA 70.0
Operating junction and storage temperature range TJ, TSTG -55 to +150 °C
NOTES:
(1) On glass epoxy P.C.B. mounted on 0.05 x 0.05” (1.3 x 1.3mm) solder pads
(2) On aluminum substrate P.C.B. with an area of 0.8 x 0.8 x 0.25” (20 x 20 x 6.4mm) mounted
on 0.05 x 0.05” (1.3 x1.3mm) solder pad
(3) Measured at 1.0 MHZ and applied reverse voltage of 4.0 Volts
0.147 (3.73)
0.137 (3.48)
0.144 (3.65)
0.161 (4.10)
0.106 (2.70)
0.090 (2.30)
0.190 (4.83)
0.179 (4.55)
0.029 (0.74)
0.017 (0.43)
0.012 (0.30)
0.008 (0.20)
0.105 (2.67)
0.095 (2.41)
0.047 (1.19)
0.038 (0.96)
0.205 (5.21)
0.195 (4.95)
0-10°
0.117 (2.97)
0.107 (2.72)
0.028 (0.71)
0.020 (0.51)
0.016(0.41)
0.006 (0.15)
0.100 (2.54)
MIN.
0.049 (1.24)
0.039 (0.99)
Case Style MBM
Dimensions in inches and (millimeters)
PATENT PENDING PATENT PENDING PATENT PENDING
更多器件搜索就在Datasheet 厂商器件资料